BS EN IEC 61189-2-809:2025

Test Methods for Electrical Materials, Circuit Boards, and Other Interconnection Structures and Assemblies

X/Y Coefficient of Thermal Expansion (CTE) Test for Thick Base Materials by TMA

Introducing the BS EN IEC 61189-2-809:2025, a comprehensive standard that provides detailed test methods for evaluating the X/Y coefficient of thermal expansion (CTE) in thick base materials using Thermomechanical Analysis (TMA). This standard is essential for professionals in the field of electrical materials and circuit board manufacturing, offering precise guidelines to ensure the reliability and performance of interconnection structures and assemblies.

Key Features

• Standard Number: BS EN IEC 61189-2-809:2025
• Pages: 14
• Release Date: February 4, 2025
• ISBN: 978 0 539 18767 0
• Status: Standard

Overview

The BS EN IEC 61189-2-809:2025 standard is a pivotal document for engineers and quality assurance professionals involved in the design and production of electronic components. It outlines the procedures for measuring the X/Y coefficient of thermal expansion, a critical parameter that affects the dimensional stability and mechanical integrity of circuit boards and other interconnection structures.

Thermal expansion can significantly impact the performance of electronic assemblies, especially in environments with fluctuating temperatures. By adhering to the methods described in this standard, manufacturers can accurately assess the thermal expansion properties of their materials, ensuring that their products meet the necessary performance criteria and reliability standards.

Why Choose This Standard?

The BS EN IEC 61189-2-809:2025 standard is designed to provide a robust framework for testing and evaluating the thermal expansion characteristics of thick base materials. Here are some reasons why this standard is indispensable:

• Precision and Accuracy: The standard offers precise methodologies for conducting TMA tests, ensuring accurate and repeatable results.
• Comprehensive Guidelines: It covers all aspects of the testing process, from sample preparation to data analysis, providing a complete solution for thermal expansion testing.
• Industry Relevance: As electronic devices become more complex, understanding the thermal properties of materials is crucial for maintaining performance and reliability.
• Global Recognition: Being an IEC standard, it is recognized and respected worldwide, facilitating international trade and collaboration.

Applications

This standard is applicable to a wide range of industries and applications, including:

• Electronics Manufacturing: Ensuring the reliability of circuit boards and electronic assemblies.
• Automotive Industry: Evaluating materials used in automotive electronics to withstand temperature variations.
• Aerospace and Defense: Testing materials for use in high-stress, temperature-variable environments.
• Telecommunications: Ensuring the stability and performance of communication devices and infrastructure.

Conclusion

The BS EN IEC 61189-2-809:2025 standard is an essential tool for any organization involved in the production or testing of electronic materials and assemblies. By providing a clear and detailed methodology for assessing the thermal expansion properties of thick base materials, this standard helps ensure that products are both reliable and high-performing in a variety of environmental conditions.

Investing in this standard means investing in the quality and reliability of your products, ultimately leading to greater customer satisfaction and success in the marketplace. Stay ahead of the competition by ensuring your materials meet the highest standards of thermal performance with the BS EN IEC 61189-2-809:2025.

BS EN IEC 61189-2-809:2025

This standard BS EN IEC 61189-2-809:2025 Test methods for electrical materials, circuit boards and other interconnection structures and assemblies is classified in these ICS categories:

• 29.035.10 Paper and board insulating materials
• 31.180 Printed circuits and boards

IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.