BS EN IEC 61189-3-302:2025

Test Methods for Electrical Materials, Printed Boards, and Other Interconnection Structures and Assemblies

Detection of Plating Defects in Unpopulated Circuit Boards by Computed Tomography (CT)

Introducing the BS EN IEC 61189-3-302:2025, a comprehensive standard that sets the benchmark for testing methods in the realm of electrical materials, printed boards, and interconnection structures. This standard is pivotal for professionals in the electronics industry, providing a robust framework for the detection of plating defects in unpopulated circuit boards using advanced computed tomography (CT) techniques.

Key Features:

• Standard Number: BS EN IEC 61189-3-302:2025
• Pages: 24
• Release Date: December 2, 2025
• ISBN: 978 0 539 31019 1
• Status: Standard

This standard is an essential tool for ensuring the quality and reliability of circuit boards, which are the backbone of modern electronic devices. By employing computed tomography, this standard allows for a non-destructive evaluation of circuit boards, ensuring that any plating defects are identified with precision and accuracy.

Why Choose BS EN IEC 61189-3-302:2025?

The BS EN IEC 61189-3-302:2025 standard is designed to meet the needs of manufacturers, quality assurance professionals, and engineers who demand the highest levels of precision in their testing processes. Here are some reasons why this standard is indispensable:

• Advanced Detection: Utilizes computed tomography (CT) to detect even the most minute plating defects, ensuring the highest quality standards.
• Comprehensive Coverage: Spanning 24 pages, this standard provides detailed methodologies and guidelines for effective testing.
• Up-to-Date: Released in December 2025, it reflects the latest advancements and best practices in the industry.
• Global Recognition: As a part of the BS EN IEC series, it is recognized and respected worldwide, ensuring compliance with international standards.

Applications:

The BS EN IEC 61189-3-302:2025 standard is applicable across a wide range of industries where circuit boards are used, including:

• Consumer Electronics
• Automotive Industry
• Aerospace and Defense
• Telecommunications
• Medical Devices

By implementing this standard, organizations can significantly reduce the risk of defects in their products, leading to enhanced performance, reliability, and customer satisfaction.

Benefits of Computed Tomography (CT) in Circuit Board Testing:

Computed tomography (CT) is a cutting-edge technology that offers numerous advantages in the testing of circuit boards:

• Non-Destructive Testing: CT allows for the inspection of circuit boards without causing any damage, preserving the integrity of the product.
• High Precision: Capable of detecting defects at a microscopic level, ensuring that even the smallest issues are identified and addressed.
• 3D Imaging: Provides a comprehensive view of the circuit board, allowing for a thorough analysis of its structure and components.
• Time Efficiency: Speeds up the testing process, enabling quicker turnaround times and increased productivity.

Conclusion:

The BS EN IEC 61189-3-302:2025 standard is an invaluable resource for any organization involved in the production or testing of circuit boards. By adhering to this standard, companies can ensure that their products meet the highest quality standards, reducing the risk of defects and enhancing overall performance. With its focus on advanced computed tomography techniques, this standard represents the future of circuit board testing, offering unparalleled precision and reliability.

Invest in the BS EN IEC 61189-3-302:2025 standard today and take the first step towards ensuring the quality and reliability of your circuit boards.

BS EN IEC 61189-3-302:2025

This standard BS EN IEC 61189-3-302:2025 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:

• 31.180 Printed circuits and boards