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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
immediate downloadReleased: 2018-04-18
BS EN IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

BS EN IEC 61249-2-47:2018

Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

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Standard number:BS EN IEC 61249-2-47:2018
Pages:28
Released:2018-04-18
ISBN:978 0 580 99201 8
Status:Standard
DESCRIPTION

BS EN IEC 61249-2-47:2018


This standard BS EN IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures is classified in these ICS categories:
  • 31.180 Printed circuits and boards
IEC 61249-2-47:2018(E) gives requirements for properties of non-halogenated epoxide non?woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Thermal conductivity is defined to be (2,0 ± 0,30) W/(m•K).


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