Don't have a credit card? Never mind we support BANK TRANSFER .

PRICES include / exclude VAT
Homepage>BS Standards>31 ELECTRONICS>31.140 Piezoelectric and dielectric devices>BS EN IEC 62276:2025 Single crystal wafers for surface acoustic wave (SAW) device applications. Specifications and measuring methods
immediate downloadReleased: 2025-04-30
BS EN IEC 62276:2025 Single crystal wafers for surface acoustic wave (SAW) device applications. Specifications and measuring methods

BS EN IEC 62276:2025

Single crystal wafers for surface acoustic wave (SAW) device applications. Specifications and measuring methods

Format
Availability
Price and currency
English Secure PDF
Immediate download
333.50 EUR
English Hardcopy
In stock
333.50 EUR
Standard number:BS EN IEC 62276:2025
Pages:46
Released:2025-04-30
ISBN:978 0 539 25760 1
Status:Standard

BS EN IEC 62276:2025 - Single Crystal Wafers for Surface Acoustic Wave (SAW) Device Applications

Introducing the BS EN IEC 62276:2025, a comprehensive standard that sets the benchmark for single crystal wafers used in surface acoustic wave (SAW) device applications. This essential document provides detailed specifications and measuring methods, ensuring that your SAW devices meet the highest quality and performance standards.

Key Features of BS EN IEC 62276:2025

  • Standard Number: BS EN IEC 62276:2025
  • Pages: 46
  • Release Date: April 30, 2025
  • ISBN: 978 0 539 25760 1
  • Status: Standard

Why Choose BS EN IEC 62276:2025?

The BS EN IEC 62276:2025 standard is an indispensable resource for professionals in the field of electronics and materials science. It provides a detailed framework for the production and evaluation of single crystal wafers, which are critical components in the manufacturing of SAW devices. These devices are widely used in various applications, including telecommunications, signal processing, and sensing technologies.

Comprehensive Specifications

This standard offers a thorough set of specifications that cover all aspects of single crystal wafer production. From material properties to dimensional tolerances, the BS EN IEC 62276:2025 ensures that every wafer meets the stringent requirements necessary for optimal SAW device performance.

Advanced Measuring Methods

In addition to specifications, this standard provides advanced measuring methods that allow for precise evaluation of wafer characteristics. These methods are designed to ensure consistency and reliability in the production process, ultimately leading to superior device performance.

Applications of Single Crystal Wafers in SAW Devices

Single crystal wafers are a fundamental component in the fabrication of SAW devices. These devices are integral to a wide range of applications, including:

  • Telecommunications: SAW devices are used in filters and oscillators, playing a crucial role in the transmission and reception of signals.
  • Signal Processing: They are essential in the processing of electronic signals, providing high precision and stability.
  • Sensing Technologies: SAW devices are employed in sensors for detecting physical phenomena such as pressure, temperature, and chemical composition.

Benefits of Implementing BS EN IEC 62276:2025

By adhering to the BS EN IEC 62276:2025 standard, manufacturers and engineers can ensure that their SAW devices are built to the highest quality standards. This leads to several key benefits:

  • Enhanced Performance: Devices manufactured according to this standard exhibit superior performance characteristics, including improved signal clarity and reduced noise.
  • Increased Reliability: The rigorous specifications and measuring methods ensure that each wafer is consistent and reliable, reducing the risk of device failure.
  • Global Compatibility: As an internationally recognized standard, BS EN IEC 62276:2025 facilitates global trade and compatibility, allowing products to meet international market demands.

Conclusion

The BS EN IEC 62276:2025 standard is a vital tool for anyone involved in the production and application of single crystal wafers for SAW devices. With its comprehensive specifications and advanced measuring methods, this standard ensures that your products meet the highest levels of quality and performance. Whether you are a manufacturer, engineer, or researcher, implementing this standard will provide you with the confidence and assurance needed to excel in the competitive field of SAW technology.

Stay ahead in the industry by adopting the BS EN IEC 62276:2025 standard and ensure that your SAW devices are at the forefront of innovation and excellence.

DESCRIPTION

BS EN IEC 62276:2025


This standard BS EN IEC 62276:2025 Single crystal wafers for surface acoustic wave (SAW) device applications. Specifications and measuring methods is classified in these ICS categories:
  • 31.140 Piezoelectric devices
IEC 62276:2025 applies to the manufacture of synthetic quartz, lithium niobate (LN), lithium tantalate (LT), lithium tetraborate (LBO), and lanthanum gallium silicate (LGS) single crystal wafers intended for use as substrates in the manufacture of surface acoustic wave (SAW) filters and resonators. This edition includes the following significant technical changes with respect to the previous edition: a) The terms and definitions, the technical requirements, sampling frequency, test methods and measurement of transmittance, lightness, colour difference for LN and LT have been added in order to meet the needs of industry development; b) The term “inclusion” (mentioned in 4.13 and 6.10) and its definition have been added because there was no definition for it in Clause 3; c) The specification of LTV and PLTV, and the corresponding description of sampling frequency for LN and LT have been added, because they are the key performance parameters for the wafers; d) The tolerance of Curie temperature specification for LN and LT have been added in order to meet the development requirements of the industry; e) Measurement of thickness, TV5, TTV, LTV and PLTV have been completed, including measurement principle and method of thickness, TV5, TTV, LTV and PLTV.