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Homepage>BSI Standards >31 ELECTRONICS>31.240 Mechanical structures for electronic equipment

31.240 Mechanical structures for electronic equipment

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76 results
First page12467Last page
BS EN IEC 61587-1:2022 - TC
Tracked Changes. Mechanical structures for electrical and electronic equipment. Tests for IEC 60917 and IEC 60297 series Environmental requirements, test setups and safety aspects
Released: 2022-05-12
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BS EN 60297-3-104:2006
Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6mm(19 in) series Connector dependent interface dimensions of subracks and plug-in units
Released: 2007-04-30
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BS EN IEC 62610-2:2018
Mechanical structures for electrical and electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Method for the determination of forced air cooling structure
Released: 2018-07-19
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BS EN 60297-3-102:2004
Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series Injector/extractor handle
Released: 2006-06-30
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BS EN 60917-2-5:2012
Modular order for the development of mechanical structures for electronic equipment practices Sectional specification. Interface co-ordination dimensions for the 25 mm equipment practice. Cabinet interface dimensions for miscellaneous equipment
Released: 2012-10-31
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PD IEC TR 60286-7:2019
Packaging of components for automatic handling Introduction of a bulk blister pack for miniaturized components
Released: 2019-10-29
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BS EN IEC 60286-3:2022
Packaging of components for automatic handling Packaging of surface mount components on continuous tapes
Released: 2023-01-17
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BS EN 61191-4:2017
Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
Released: 2017-11-20
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BS EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
Released: 2016-10-31
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DD IEC/TS 62610-2:2011
Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Design guide. Method for the determination of forced air-cooling structure
Released: 2011-08-31
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DD IEC/TS 62610-3:2009
Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Design guide. Evaluation method for thermoelectrical cooling systems (Peltier effect)
Released: 2010-02-28
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DD IEC/TS 62610-1:2009
Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
Released: 2010-01-31
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76 results
First page12467Last page