Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 60191-6-17 - Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Released: 01.12.2011
CSN EN 60191-6-17
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
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English Hardcopy
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Number of Standard:
CSN EN 60191-6-17
Category:
358791
Pages:
40
Released:
01.12.2011
Catalog number:
89571
DESCRIPTION
CSN EN 60191-6-17
CSN EN 60191-6-17 Tato norma poskytuje společné výkresy a rozměry pro vrstvená pouzdra a pro samostatná pouzdra, které je možno vrstvit v provedení FBGA nebo FLGA. Original English text of CSN EN Standard. The price of the Standard included all amendments and correcturs.
