3587 Semiconductor elements

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Released: 2007
CSN EN 60191-1
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
LANGUAGE
English
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Released: 2014
CSN EN 60191-4 ed. 2
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
LANGUAGE
English
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Released: 2009
CSN EN 60191-6 ed. 2
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
LANGUAGE
English
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Released: 2003
CSN EN 60191-6-10
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
LANGUAGE
English
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Released: 2011
CSN EN 60191-6-12 ed. 2
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
LANGUAGE
English
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Released: 2007
CSN EN 60191-6-13
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
LANGUAGE
English
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Released: 2016
CSN EN 60191-6-13 ed. 2
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
LANGUAGE
English
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Released: 2007
CSN EN 60191-6-16
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
LANGUAGE
English
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Released: 2011
CSN EN 60191-6-17
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
LANGUAGE
English
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Released: 2010
CSN EN 60191-6-18
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
LANGUAGE
English
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Released: 2010
CSN EN 60191-6-19
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
LANGUAGE
English
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Released: 2010
CSN EN 60191-6-20
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010)
LANGUAGE
English