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CSN EN 62047-19
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
Released: 01.04.2014
English Hardcopy
In stock
129.41 USD
English Hardcopy
In stock
111.76 USD
CSN EN 62047-22
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Released: 01.04.2015
English Hardcopy
In stock
94.12 USD
CSN EN 60749-42
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
Released: 01.04.2015
English Hardcopy
In stock
82.35 USD
CSN EN 62047-17
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Released: 01.09.2015
English Hardcopy
In stock
111.76 USD
CSN EN 62047-2
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Released: 01.05.2007
English Hardcopy
In stock
111.76 USD
CSN EN 62258-6
Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
Released: 01.06.2007
English Hardcopy
In stock
82.35 USD
CSN EN 60191-6-16
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Released: 01.01.2008
English Hardcopy
In stock
82.35 USD
CSN EN 61964
Integrated circuits - Memory devices pin configurations
Integrated circuits - Memory devices pin configurations
Released: 01.06.2000
English Hardcopy
In stock
147.06 USD
CSN IEC 60191-2X
Mechanical standardization of semiconductor devices - Part 2: Dimensions - Twenty-second supplement
Mechanical standardization of semiconductor devices - Part 2: Dimensions - Twenty-second supplement
Released: 01.08.2000
English Hardcopy
In stock
35.29 USD
CSN IEC 60191-2Y
Mechanical standardization of semiconductor devices - Part 2: Dimensions - Twenty-third supplement
Mechanical standardization of semiconductor devices - Part 2: Dimensions - Twenty-third supplement
Released: 01.04.2001
English Hardcopy
In stock
35.29 USD
CSN EN 60749-8
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Released: 01.12.2003
English Hardcopy
In stock
129.41 USD