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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 62047-2 - Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
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CSN EN 62047-2 - Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

CSN EN 62047-2

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

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English Hardcopy
In stock
64.71 USD
Category:358775
Released:2006
Number of Standard:CSN EN 62047-2
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EN 62047-2


EN 62047-2 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials - Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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