PRICES include / exclude VAT
Sponsored link
FREE SHIPPINGReleased: 2009
CSN EN 62137-1-4
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1- 4: Cyclic bending test
Format
Availability
Price and currency
English Hardcopy
In stock
61.11 USD
Category: | 359391 |
Released: | 2009 |
Number of Standard: | CSN EN 62137-1-4 |
DESCRIPTION
EN 62137-1-4
EN 62137-1-4 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1- 4: Cyclic bending test - The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
Related products
English Hardcopy
In stock
85.55 USD
English Hardcopy
In stock
61.11 USD
English Hardcopy
In stock
61.11 USD
English Hardcopy
In stock
61.11 USD
English Hardcopy
In stock
70.00 USD
English Hardcopy
In stock
70.00 USD
English Hardcopy
In stock
93.34 USD
English Hardcopy
In stock
85.55 USD
CSN EN 62878-1-1
Device embedded substrate - Part 1-1: Generic specification - Test methods
Device embedded substrate - Part 1-1: Generic specification - Test methods
Released: 2015
English Hardcopy
In stock
97.78 USD
CSN EN 62090 ed. 2
Product package labels for electronic components using bar code and two-dimensional symbologies
Product package labels for electronic components using bar code and two-dimensional symbologies
Released: 2017
English Hardcopy
In stock
85.55 USD