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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3593 Surface mounting technology>CSN EN 62137-1-4 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1- 4: Cyclic bending test
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CSN EN 62137-1-4 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1- 4: Cyclic bending test

CSN EN 62137-1-4

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1- 4: Cyclic bending test

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English Hardcopy
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61.11 USD
Category:359391
Released:2009
Number of Standard:CSN EN 62137-1-4
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EN 62137-1-4


EN 62137-1-4 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1- 4: Cyclic bending test - The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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