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>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN IEC 61189-2-805 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
Released: 01.10.2024
CSN EN IEC 61189-2-805 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

CSN EN IEC 61189-2-805

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

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Number of Standard:CSN EN IEC 61189-2-805
Category:359039
Pages:20
Released:01.10.2024
Catalog number:519736
DESCRIPTION

CSN EN IEC 61189-2-805

CSN EN IEC 61189-2-805 This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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