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>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN IEC 61189-2-809 - Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
Released: 01.06.2025
CSN EN IEC 61189-2-809 - Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

CSN EN IEC 61189-2-809

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

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Number of Standard:CSN EN IEC 61189-2-809
Category:359039
Pages:20
Released:01.06.2025
Catalog number:521230
DESCRIPTION

CSN EN IEC 61189-2-809

CSN EN IEC 61189-2-809 This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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