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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3593 Surface mounting technology>CSN EN IEC 62878-2-603 - Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
Released: 01.08.2025
CSN EN IEC 62878-2-603 - Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

CSN EN IEC 62878-2-603

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

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Number of Standard:CSN EN IEC 62878-2-603
Category:359378
Pages:24
Released:01.08.2025
Catalog number:521881
DESCRIPTION

CSN EN IEC 62878-2-603

CSN EN IEC 62878-2-603 This part of IEC 62878 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.