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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards>DD IEC/PAS 61249-3-1:2007 Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
immediate downloadReleased: 2007-10-31
DD IEC/PAS 61249-3-1:2007 Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

DD IEC/PAS 61249-3-1:2007

Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

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246.40 EUR
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246.40 EUR
Standard number:DD IEC/PAS 61249-3-1:2007
Pages:32
Released:2007-10-31
ISBN:978 0 580 59472 4
Status:Standard
DESCRIPTION

DD IEC/PAS 61249-3-1:2007


This standard DD IEC/PAS 61249-3-1:2007 Materials for printed boards and other interconnecting structures is classified in these ICS categories:
  • 31.180 Printed circuits and boards
Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types
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