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in stockReleased: 2025-11
DIN EN IEC 61189-3-302
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV:2024); German and English version prEN IEC 61189-3-302:2024
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3-302: Erkennung von Beschichtungsfehlern in unbestückten Leiterplatten durch Computertomographie (CT) (IEC 91/1973/CDV:2024); Deutsche und Englische Fassung prEN IEC 61189-3-302:2024
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English PDF
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104.87 EUR
English Hardcopy
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German PDF
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104.87 EUR
German Hardcopy
In stock
104.87 EUR
| Status: | Draft |
| Released: | 2025-11 |
| Standard number: | DIN EN IEC 61189-3-302 |
| Name: | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV:2024); German and English version prEN IEC 61189-3-302:2024 |
| Pages: | 32 |
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