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>ICS codes>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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179 results
First page1245678...131415Last page
UNE EN IEC 61188-6-4:2019
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (Endorsed by Asociación Española de Normalización in August of 2019.)
Released: 2019-08-01
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Printable
91.30 EUR
English Hardcopy
In stock
91.30 EUR
UNE EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures -- Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in July of 2005.)
Released: 2005-07-01
English PDF
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Printable
74.80 EUR
English Hardcopy
In stock
74.80 EUR
UNE EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in May of 2013.)
Released: 2013-05-01
English PDF
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Printable
72.60 EUR
English Hardcopy
In stock
72.60 EUR
UNE EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures -- Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in June of 2009.)
Released: 2009-06-01
English PDF
Immediate download
Printable
74.80 EUR
English Hardcopy
In stock
74.80 EUR
UNE EN 61249-2-44:2016
Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)
Released: 2016-08-01
English PDF
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Printable
72.60 EUR
English Hardcopy
In stock
72.60 EUR
UNE EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures -- Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability (Endorsed by AENOR in January of 2006.)
Released: 2006-01-01
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Printable
69.30 EUR
English Hardcopy
In stock
69.30 EUR
UNE EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures -- Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in December of 2009.)
Released: 2009-12-01
English PDF
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Printable
66.00 EUR
English Hardcopy
In stock
66.00 EUR
UNE EN 62496-1:2009
Optical circuit boards -- Part 1: General standard (Endorsed by AENOR in July of 2009.)
Released: 2009-07-01
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Printable
74.80 EUR
English Hardcopy
In stock
74.80 EUR
UNE EN 62496-4:2011
Optical circuit boards - Interface standards - Part 4: General and guidance (Endorsed by AENOR in July of 2011.)
Released: 2011-07-01
English PDF
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79.20 EUR
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In stock
79.20 EUR
UNE EN IEC 62878-2-602:2021
Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (Endorsed by Asociación Española de Normalización in October of 2021.)
Released: 2021-10-01
English PDF
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Printable
69.30 EUR
English Hardcopy
In stock
69.30 EUR
UNE EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (Endorsed by Asociación Española de Normalización in April of 2021.)
Released: 2021-04-01
English PDF
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Printable
75.90 EUR
English Hardcopy
In stock
75.90 EUR
UNE EN IEC 62878-2-5:2019
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (Endorsed by Asociación Española de Normalización in December of 2019.)
Released: 2019-12-01
English PDF
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Printable
107.80 EUR
English Hardcopy
In stock
107.80 EUR
179 results
First page1245678...131415Last page