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>ICS codes>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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183 results
First page1245678...141516Last page
UNE EN IEC 61188-6-4:2019
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (Endorsed by Asociación Española de Normalización in August of 2019.)
Released: 2019-08-01
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104.50 EUR
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104.50 EUR
UNE EN IEC 62878-2-5:2019
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (Endorsed by Asociación Española de Normalización in December of 2019.)
Released: 2019-12-01
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123.20 EUR
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123.20 EUR
UNE EN 123000:1991
GENERIC SPECIFICATION: PRINTED BOARDS. (Endorsed by AENOR in June of 1996.)
Released: 1996-06-01
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81.40 EUR
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81.40 EUR
UNE EN 61189-1:1997/A1:2001
Test methods for electrical materials, interconnection structures and assemblies -- Part 1: General test methods and methodology. (Endorsed by AENOR in March of 2002.)
Released: 2002-03-01
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45.10 EUR
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45.10 EUR
UNE EN 61189-2-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (Endorsed by AENOR in November of 2016.)
Released: 2016-11-01
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75.90 EUR
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75.90 EUR
UNE EN 61189-5-2:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (Endorsed by AENOR in April of 2015.)
Released: 2015-04-01
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102.30 EUR
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102.30 EUR
UNE EN 61189-5-4:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (Endorsed by AENOR in April of 2015.)
Released: 2015-04-01
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81.40 EUR
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81.40 EUR
UNE EN 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (Endorsed by Asociación Española de Normalización in September of 2017.)
Released: 2017-09-01
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78.10 EUR
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78.10 EUR
UNE EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures -- Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in July of 2005.)
Released: 2005-07-01
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78.10 EUR
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78.10 EUR
UNE EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in May of 2013.)
Released: 2013-05-01
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75.90 EUR
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75.90 EUR
UNE EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures -- Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in June of 2009.)
Released: 2009-06-01
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77.00 EUR
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77.00 EUR
UNE EN 61249-2-44:2016
Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)
Released: 2016-08-01
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75.90 EUR
English Hardcopy
In stock
75.90 EUR
183 results
First page1245678...141516Last page