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Homepage>ICS codes>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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179 results
First page135678...131415Last page
UNE EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures -- Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability (Endorsed by AENOR in January of 2006.)
Released: 2006-01-01
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69.30 EUR
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In stock
69.30 EUR
UNE EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures -- Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in December of 2009.)
Released: 2009-12-01
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66.00 EUR
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In stock
66.00 EUR
UNE EN 62496-1:2009
Optical circuit boards -- Part 1: General standard (Endorsed by AENOR in July of 2009.)
Released: 2009-07-01
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74.80 EUR
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In stock
74.80 EUR
UNE EN 62496-4:2011
Optical circuit boards - Interface standards - Part 4: General and guidance (Endorsed by AENOR in July of 2011.)
Released: 2011-07-01
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79.20 EUR
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79.20 EUR
UNE EN IEC 62496-2-5:2023
Optical circuit boards - Basic test and measurement procedures - Part 2-5: Flexibility test for flexible opto-electric circuits (Endorsed by Asociación Española de Normalización in March of 2023.)
Released: 2023-03-01
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75.90 EUR
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75.90 EUR
UNE EN IEC 62878-2-602:2021
Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (Endorsed by Asociación Española de Normalización in October of 2021.)
Released: 2021-10-01
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69.30 EUR
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In stock
69.30 EUR
UNE EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (Endorsed by Asociación Española de Normalización in April of 2021.)
Released: 2021-04-01
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75.90 EUR
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In stock
75.90 EUR
UNE EN IEC 61189-2-809:2025
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA (Endorsed by Asociación Española de Normalización in March of 2025.)
Released: 2025-03-01
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63.80 EUR
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In stock
63.80 EUR
UNE EN 60249-2-1/A3:1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
Released: 1996-10-09
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34.32 EUR
English Hardcopy
In stock
34.32 EUR
Spanish PDF
Immediate download
28.60 EUR
Spanish Hardcopy
In stock
28.60 EUR
UNE EN 60249-2-12:1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
Released: 1996-07-24
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63.80 EUR
Spanish Hardcopy
In stock
63.80 EUR
UNE EN 60249-2-13:1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
Released: 1996-07-24
English PDF
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77.88 EUR
English Hardcopy
In stock
77.88 EUR
Spanish PDF
Immediate download
64.90 EUR
Spanish Hardcopy
In stock
64.90 EUR
UNE EN 60249-2-15/A1:1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
Released: 1996-10-14
English PDF
Immediate download
34.32 EUR
English Hardcopy
In stock
34.32 EUR
Spanish PDF
Immediate download
28.60 EUR
Spanish Hardcopy
In stock
28.60 EUR
179 results
First page135678...131415Last page