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>ICS codes>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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180 results
First page135678...131415Last page
UNE EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in May of 2013.)
Released: 2013-05-01
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85.41 USD
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In stock
85.41 USD
UNE EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures -- Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in June of 2009.)
Released: 2009-06-01
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Printable
88.00 USD
English Hardcopy
In stock
88.00 USD
UNE EN 61249-2-44:2016
Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)
Released: 2016-08-01
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Printable
85.41 USD
English Hardcopy
In stock
85.41 USD
UNE EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures -- Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability (Endorsed by AENOR in January of 2006.)
Released: 2006-01-01
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Printable
81.53 USD
English Hardcopy
In stock
81.53 USD
UNE EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures -- Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in December of 2009.)
Released: 2009-12-01
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Printable
77.65 USD
English Hardcopy
In stock
77.65 USD
UNE EN IEC 62878-2-602:2021
Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (Endorsed by Asociación Española de Normalización in October of 2021.)
Released: 2021-10-01
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Printable
81.53 USD
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In stock
81.53 USD
UNE EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (Endorsed by Asociación Española de Normalización in April of 2021.)
Released: 2021-04-01
English PDF
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Printable
89.29 USD
English Hardcopy
In stock
89.29 USD
UNE EN IEC 61189-2-809:2025
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA (Endorsed by Asociación Española de Normalización in March of 2025.)
Released: 2025-03-01
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Printable
75.06 USD
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In stock
75.06 USD
UNE EN 61249-2-6:2005
Materials for printed boards and other interconnecting structures -- Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Released: 2005-07-13
English PDF
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Printable
111.81 USD
English Hardcopy
In stock
111.81 USD
Spanish PDF
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Printable
93.18 USD
Spanish Hardcopy
In stock
93.18 USD
UNE EN 61249-7-1:1997
MATERIALS FOR INTERCONNECTION STRUCTURES. PART 7: SECTIONAL SPECIFICATION SET FOR RESTRAINING CORE MATERIALS. SECTION 1: COPPER/INVAR/COPPER.
Released: 1997-10-17
English PDF
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Printable
72.99 USD
English Hardcopy
In stock
72.99 USD
Spanish PDF
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Printable
60.82 USD
Spanish Hardcopy
In stock
60.82 USD
UNE EN 61249-8-7:1997
MATERIALS FOR INTERCONNECTION STRUCTURES. PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS. SECTION 7: MARKING LEGEND INKS.
Released: 1997-10-17
English PDF
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Printable
107.15 USD
English Hardcopy
In stock
107.15 USD
Spanish PDF
Immediate download
Printable
89.29 USD
Spanish Hardcopy
In stock
89.29 USD
UNE EN 61249-8-8:2000
Materials for interconnection structures -- Part 8: Sectional specification set for non-conductive films and coatings -- Section 8: Temporary polymer coatings.
Released: 2000-11-21
English PDF
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Printable
91.62 USD
English Hardcopy
In stock
91.62 USD
Spanish PDF
Immediate download
Printable
76.35 USD
Spanish Hardcopy
In stock
76.35 USD
180 results
First page135678...131415Last page