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download between 0-24 hoursReleased: 2003-11-19
IEC 60191-6-10:2003
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-10: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Dimensions des boîtiers P-VSON
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English PDF
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86.40 EUR
English Hardcopy
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English/French - Bilingual PDF
Immediate download
86.40 EUR
English/French - Bilingual Hardcopy
in stock
86.40 EUR
| Standard number: | IEC 60191-6-10:2003 |
| Released: | 2003-11-19 |
| Edition: | 1 |
| ICS: | 31.080.01 |
| Pages (English): | 12 |
| ISBN (English): | 2831872839 |
| Pages (English/French - Bilingual): | 24 |
| ISBN (English/French - Bilingual): | 9782832205204 |
DESCRIPTION
IEC 60191-6-10:2003
IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).