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>IEC Standards>IEC 60191-6-2:2001/COR1:2002 - Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
immediate downloadReleased: 2002-10-18
IEC 60191-6-2:2001/COR1:2002 - Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

IEC 60191-6-2:2001/COR1:2002

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

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Standard number:IEC 60191-6-2:2001/COR1:2002
Released:2002-10-18
Edition:1
ICS:31.080.01
Pages (English):0
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IEC 60191-6-2:2001/COR1:2002

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