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Homepage>IEC Standards>IEC 60749-32:2002/COR1:2003 - Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
download between 0-24 hoursReleased: 2003-08-13
IEC 60749-32:2002/COR1:2003 - Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

IEC 60749-32:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

Corrigendum 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 32: Inflammabilité des dispositifs à encapsulation plastique (cas d'une cause extérieure d'inflammation)

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Standard number:IEC 60749-32:2002/COR1:2003
Released:2003-08-13
Edition:1
ICS:31.080.01
Pages (English/French - Bilingual):0
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IEC 60749-32:2002/COR1:2003

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