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Homepage>IEC Standards>IEC 60749-35:2006 - Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
download between 0-24 hoursReleased: 2006-07-18
IEC 60749-35:2006 - Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

IEC 60749-35:2006

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 35: Microscopie acoustique pour composants électroniques à boîtier plastique

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Standard number:IEC 60749-35:2006
Released:2006-07-18
Edition:1
ICS:31.080.01
Pages (English/French - Bilingual):43
ISBN (English/French - Bilingual):2831887437
DESCRIPTION

IEC 60749-35:2006

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

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