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IEC 60749-8:2002/COR2:2003 - Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealingimmediate downloadReleased: 2003-08-12
IEC 60749-8:2002/COR2:2003
Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Corrigendum 2 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 8: Etanchéité
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| Standard number: | IEC 60749-8:2002/COR2:2003 |
| Released: | 2003-08-12 |
| Edition: | 1 |
| ICS: | 31.080.01 |
| Pages (English/French - Bilingual): | 0 |
DESCRIPTION
IEC 60749-8:2002/COR2:2003
Modification of the validity date: now put at 2007.