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Homepage>IEC Standards>IEC 61189-2-801:2023 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
download between 0-24 hoursReleased: 2023-07-26
IEC 61189-2-801:2023 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-801: Essai de conductivité thermique pour matériaux de base

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Standard number:IEC 61189-2-801:2023
Released:2023-07-26
Edition:1
ICS:31.180
Pages (English/French - Bilingual):21
ISBN (English/French - Bilingual):9782832272589
DESCRIPTION

IEC 61189-2-801:2023

IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.

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