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>IEC Standards>IEC 61190-1-1:2002 - Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
immediate downloadReleased: 2002-03-25
IEC 61190-1-1:2002 - Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

IEC 61190-1-1:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Matériaux de fixation pour les assemblages électroniques - Partie 1-1: Exigences relatives aux flux de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques

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English/French - Bilingual PDF
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167.40 EUR
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Standard number:IEC 61190-1-1:2002
Released:2002-03-25
Edition:1
ICS:31.190
Pages (English/French - Bilingual):41
ISBN (English/French - Bilingual):2831862337
DESCRIPTION

IEC 61190-1-1:2002

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

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