Don't have a credit card? Never mind we support BANK TRANSFER .

Log inSign up
LANGUAGE en
Menu
STOREHelp centerContactsDelivery chargesABOUT US News
SEARCH
0
Total price
0 EUR
PRICES include / exclude VAT
Homepage>IEC Standards>IEC 62047-9:2011/COR1:2012 - Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
download between 0-24 hoursReleased: 2012-03-08
IEC 62047-9:2011/COR1:2012 - Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

IEC 62047-9:2011/COR1:2012

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

Corrigendum 1 - Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 9: Mesure de la résistance de collage de deux plaquettes pour les MEMS

Format
Availability
Price and currency
English/French - Bilingual PDF
Immediate download
0.00 EUR
English/French - Bilingual Hardcopy
in stock
0.00 EUR
Standard number:IEC 62047-9:2011/COR1:2012
Released:2012-03-08
Edition:1
ICS:31.080.99
Pages (English/French - Bilingual):0
DESCRIPTION

IEC 62047-9:2011/COR1:2012

Print