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Homepage>IEC Standards>IEC 62148-21:2019 - Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
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download between 0-24 hoursReleased: 2019-03-11
IEC 62148-21:2019 - Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

IEC 62148-21:2019

Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

Composants et dispositifs actifs fibroniques – Normes de boîtier et d’interface – Partie 21: Guide de conception de l’interface électrique des boîtiers PIC utilisant des boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FLGA)

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LANGUAGE
English/French - Bilingual
Standard number:IEC 62148-21:2019
Released:2019-03-11
Language:English/French - Bilingual
DESCRIPTION

IEC 62148-21:2019

IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. Keywords: electrical interface of photonic integrated circuit (PIC) packages