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Homepage>IEC Standards>IEC 62374-1:2010 - Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
download between 0-24 hoursReleased: 2010-09-29
IEC 62374-1:2010 - Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

IEC 62374-1:2010

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

Dispositifs à semiconducteurs - Partie 1: Essai de rupture diélectrique en fonction du temps (TDDB) pour les couches intermétalliques

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Standard number:IEC 62374-1:2010
Released:2010-09-29
Edition:1
ICS:31.080.99
Pages (English/French - Bilingual):32
ISBN (English/French - Bilingual):9782889121786
DESCRIPTION

IEC 62374-1:2010

IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

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