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Homepage>IEC Standards>IEC 62878-1:2019 - Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
download between 0-24 hoursReleased: 2019-10-14
IEC 62878-1:2019 - Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

IEC 62878-1:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

Techniques d’assemblage avec appareils intégrés - Partie 1: Spécification générique pour substrats avec appareils intégrés

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Standard number:IEC 62878-1:2019
Released:2019-10-14
Edition:1
ICS:31.180
Pages (English):19
ISBN (English):9782832274606
Pages (English/French - Bilingual):38
ISBN (English/French - Bilingual):9782832279496
DESCRIPTION

IEC 62878-1:2019

IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.