Don't have a credit card? Never mind we support BANK TRANSFER .

Log inSign up
LANGUAGE en
Menu
STOREHelp centerContactsDelivery chargesABOUT US News
SEARCH
0
Total price
0 EUR
PRICES include / exclude VAT
Homepage>IEC Standards>IEC 63251:2023 - Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
download between 0-24 hoursReleased: 2023-11-01
IEC 63251:2023 - Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

Méthode d’essai des propriétés mécaniques des circuits optoélectriques souples sous contrainte thermique

Format
Availability
Price and currency
English/French - Bilingual PDF
Immediate download
167.40 EUR
English/French - Bilingual Hardcopy
in stock
167.40 EUR
Standard number:IEC 63251:2023
Released:2023-11-01
Edition:1
ICS:31.180
Pages (English/French - Bilingual):42
ISBN (English/French - Bilingual):9782832277508
DESCRIPTION

IEC 63251:2023

IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

Print