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>IEC Standards>IEC 63251:2023 - Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
immediate downloadReleased: 2023-11-01
IEC 63251:2023 - Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

Méthode d’essai des propriétés mécaniques des circuits optoélectriques souples sous contrainte thermique

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English/French - Bilingual PDF
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Standard number:IEC 63251:2023
Released:2023-11-01
Edition:1
ICS:31.180
Pages (English/French - Bilingual):42
ISBN (English/French - Bilingual):9782832277508
DESCRIPTION

IEC 63251:2023

IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

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