PRICES include / exclude VAT
download between 0-24 hoursReleased: 2023-11-01
IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Méthode d’essai des propriétés mécaniques des circuits optoélectriques souples sous contrainte thermique
Format
Availability
Price and currency
English/French - Bilingual PDF
Immediate download
167.40 EUR
English/French - Bilingual Hardcopy
in stock
167.40 EUR
| Standard number: | IEC 63251:2023 |
| Released: | 2023-11-01 |
| Edition: | 1 |
| ICS: | 31.180 |
| Pages (English/French - Bilingual): | 42 |
| ISBN (English/French - Bilingual): | 9782832277508 |
DESCRIPTION
IEC 63251:2023
IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.