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IEC 62047-14:2012
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
Released: 2012-02-28
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IEC 60811-402:2012
Electric and optical fibre cables - Test methods for non-metallic materials - Part 402: Miscellaneous tests - Water absorption tests
Electric and optical fibre cables - Test methods for non-metallic materials - Part 402: Miscellaneous tests - Water absorption tests
Released: 2012-03-12
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IEC 60811-411:2012
Electric and optical fibre cables - Test methods for non-metallic materials - Part 411: Miscellaneous tests - Low-temperature brittleness of filling compounds
Electric and optical fibre cables - Test methods for non-metallic materials - Part 411: Miscellaneous tests - Low-temperature brittleness of filling compounds
Released: 2012-03-12
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IEC 60811-502:2012
Electric and optical fibre cables - Test methods for non-metallic materials - Part 502: Mechanical tests - Shrinkage test for insulations
Electric and optical fibre cables - Test methods for non-metallic materials - Part 502: Mechanical tests - Shrinkage test for insulations
Released: 2012-03-13
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English/French - Bilingual PDF
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167.40 EUR
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IEC 61967-6:2002
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
Released: 2002-06-25
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IEC 61000-4-17:1999+AMD1:2001 CSV
Electromagnetic compatibility (EMC) - Part 4-17: Testing and measurement techniques - Ripple on d.c. input power port immunity test
Electromagnetic compatibility (EMC) - Part 4-17: Testing and measurement techniques - Ripple on d.c. input power port immunity test
Released: 2002-07-08
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IEC 60749-14:2003
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Released: 2003-08-07
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86.40 EUR
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