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English/French - Bilingual PDF
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216.00 EUR
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216.00 EUR
IEC TR 60887:2010
Glass bulb designation system for lamps
Glass bulb designation system for lamps
Released: 2010-06-24
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43.20 EUR
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43.20 EUR
English/French - Bilingual PDF
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124.20 EUR
English/French - Bilingual Hardcopy
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124.20 EUR
IEC 60050-212:2010
International Electrotechnical Vocabulary (IEV) - Part 212: Electrical insulating solids, liquids and gases
International Electrotechnical Vocabulary (IEV) - Part 212: Electrical insulating solids, liquids and gases
Released: 2010-06-29
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394.20 EUR
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394.20 EUR
IEC 62554:2011
Sample preparation for measurement of mercury level in fluorescent lamps
Sample preparation for measurement of mercury level in fluorescent lamps
Released: 2011-08-19
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167.40 EUR
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167.40 EUR
IEC TS 62607-2-1:2012
Nanomanufacturing - Key control characteristics - Part 2-1: Carbon nanotube materials - Film resistance
Nanomanufacturing - Key control characteristics - Part 2-1: Carbon nanotube materials - Film resistance
Released: 2012-05-29
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86.40 EUR
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86.40 EUR
IEC 62453-303-1:2009
Field device tool (FDT) interface specification - Part 303-1: Communication profile integration - IEC 61784 CP 3/1 and CP 3/2
Field device tool (FDT) interface specification - Part 303-1: Communication profile integration - IEC 61784 CP 3/1 and CP 3/2
Released: 2009-06-30
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345.60 EUR
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345.60 EUR
English/French - Bilingual PDF
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345.60 EUR
English/French - Bilingual Hardcopy
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345.60 EUR
IEC TS 61000-5-9:2009
Electromagnetic compatibility (EMC) - Part 5-9: Installation and mitigation guidelines - System-level susceptibility assessments for HEMP and HPEM
Electromagnetic compatibility (EMC) - Part 5-9: Installation and mitigation guidelines - System-level susceptibility assessments for HEMP and HPEM
Released: 2009-07-08
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394.20 EUR
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394.20 EUR
English/French - Bilingual PDF
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43.20 EUR
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43.20 EUR
IEC 62453-315:2009
Field device tool (FDT) Interface specification - Part 315: Communication profile integration - IEC 61784 CPF 15
Field device tool (FDT) Interface specification - Part 315: Communication profile integration - IEC 61784 CPF 15
Released: 2009-07-08
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345.60 EUR
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345.60 EUR
IEC 60749-19:2003/AMD1:2010
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Released: 2010-07-28
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10.80 EUR
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10.80 EUR
IEC 60749-32:2002/AMD1:2010
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
Released: 2010-07-28
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10.80 EUR
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10.80 EUR