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Homepage>IEC Standards>IEC TR 63378-1:2021 - Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
download between 0-24 hoursReleased: 2021-12-14
IEC TR 63378-1:2021 - Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

IEC TR 63378-1:2021

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

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Standard number:IEC TR 63378-1:2021
Released:2021-12-14
Edition:1
ICS:31.080.01
Pages (English):20
ISBN (English):9782832247419
DESCRIPTION

IEC TR 63378-1:2021

IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

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