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immediate downloadReleased: 2021-12-14
IEC TR 63378-1:2021
Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
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| Standard number: | IEC TR 63378-1:2021 |
| Released: | 2021-12-14 |
| Edition: | 1 |
| ICS: | 31.080.01 |
| Pages (English): | 20 |
| ISBN (English): | 9782832247419 |
DESCRIPTION
IEC TR 63378-1:2021
IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.