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Released: 01.06.2016
IPC-1601 - Revision A
Printed Board Handling and Storage Guidelines
Format
Availability
Price and currency
Chinese Secure PDF
Immediate download
Non-printable
94.35 EUR
Chinese Hardcopy
10-14 days
141.53 EUR
English Secure PDF
Immediate download
Non-printable
94.35 EUR
English Hardcopy
10-14 days
141.53 EUR
Japanese Secure PDF
Immediate download
Non-printable
131.75 EUR
Japanese Hardcopy
10-14 days
197.63 EUR
Polish Secure PDF
Immediate download
Non-printable
131.75 EUR
Polish Hardcopy
10-14 days
197.63 EUR
Spanish Secure PDF
Immediate download
Non-printable
94.35 EUR
Spanish Hardcopy
10-14 days
141.53 EUR
View table of Contents
| Standard Number: | IPC-1601 - Revision A |
| Released: | 01.06.2016 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | A |
| ISBN (English): | 978-1-61193-249-2 |
| Pages (English): | 19 |
| ISBN (Chinese): | 978-1-61193-352-9 |
| Pages (Chinese): | 32 |
| ISBN (Japanese): | 978-1-63816-106-6 |
| Pages (Japanese): | 32 |
| ISBN (Polish): | 978-1-61193-472-4 |
| Pages (Polish): | 32 |
| ISBN (Spanish): | 978-1-61193-358-1 |
| Pages (Spanish): | 28 |
DESCRIPTION
The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. Revision A provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, mositure concerns for etched cores and composites, desiccant material and HIC cards, and example flowdowns of packaging and handling requirements.