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Current revisionReleased: 01.04.2022
IPC-4555 - Standard Only
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
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| Standard Number: | IPC-4555 - Standard Only |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Released: | 01.04.2022 |
| ISBN (English): | 978-1-63816-074-8 |
| Pages (English): | 24 |
DESCRIPTION
The IPC-4555 standard covers the requirements and testing for organic solderability preservatives (OSP) processes for printed boards to be used primarily for electrical and electronic circuits. Details for lead free soldering are covered in IPC-4555