IPC-6012 - Revision D - Redline

Track the substantive changes in IPC-6012D with this redline product. This is the D revision in its entirety, with each change highlighted on the page. Click the text to launch a pop-up with an explanation of the change from the C revision. Available for download only.

IPC-6012D covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision D incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias and dielectric removal. For use with IPC-6011. Supersedes IPC-6012C and IPC-6016