IPC-6018 - Revision D

The IPC-6018D standard covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6018D incorporates many new requirements in areas such as back-drilled holes, alternative surface finishes, pad/land anomalies, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, plating overhang/slivers and dielectric removal. For use with IPC-6011.