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Released: 30.03.2017
IPC-7530 - Revision A
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
Format
Availability
Price and currency
Chinese Secure PDF
Immediate download
Non-printable
168.30 EUR
Chinese Hardcopy
10-14 days
252.45 EUR
English Secure PDF
Immediate download
Non-printable
168.30 EUR
English Hardcopy
10-14 days
252.45 EUR
Japanese Secure PDF
Immediate download
Non-printable
235.45 EUR
Japanese Hardcopy
10-14 days
353.18 EUR
View table of Contents
| Standard Number: | IPC-7530 - Revision A |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | A |
| Released: | 30.03.2017 |
| ISBN (English): | 978-1-61193-303-1 |
| Pages (English): | 42 |
| ISBN (Chinese): | 978-1-61193-466-3 |
| Pages (Chinese): | 52 |
| ISBN (Japanese): | 978-1-63816-099-1 |
| Pages (Japanese): | 52 |
DESCRIPTION
Superseded by IPC-7530 - Revision B
This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common defects which can be attributed to profiling. 42 pages. Released March 2017