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Current revisionReleased: 31.01.2025
IPC-7530 - Revision B
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
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English Secure PDF
Immediate download
Non-printable
168.30 EUR
English Hardcopy
10-14 days
252.45 EUR
Japanese Secure PDF
Immediate download
Non-printable
235.45 EUR
Japanese Hardcopy
10-14 days
353.18 EUR
View table of Contents
| Standard Number: | IPC-7530 - Revision B |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | B |
| Released: | 31.01.2025 |
| ISBN (English): | 978-1-63816-203-2 |
| Pages (English): | 52 |
| ISBN (Japanese): | 978-1-63816-282-7 |
| Pages (Japanese): | 52 |
DESCRIPTION
This document provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies using reflow, vapor phase, laser, selective and wave soldering equipment. The document also includes a troubleshooting guide for addressing common defects which can be attributed to profiling.