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Released: 01.05.2001
IPC-7530 - Standard Only
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
Format
Availability
Price and currency
Chinese Secure PDF
Immediate download
Non-printable
168.30 EUR
Chinese Hardcopy
10-14 days
252.45 EUR
English Secure PDF
Immediate download
Non-printable
168.30 EUR
English Hardcopy
10-14 days
252.45 EUR
Hungarian Secure PDF
Immediate download
Non-printable
131.75 EUR
Hungarian Hardcopy
10-14 days
197.63 EUR
View table of Contents
| Standard Number: | IPC-7530 - Standard Only |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Released: | 01.05.2001 |
| Pages (English): | 118 |
| ISBN (Chinese): | 978-1-61193-270-6 |
| Pages (Chinese): | 18 |
| ISBN (Hungarian): | 978-1-61193-137-2 |
| Pages (Hungarian): | 18 |
DESCRIPTION
Superseded by IPC-7530 - Revision A
During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach this minimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This document provides guidelines for the construction of appropriate profiling test vehicles and various techniques and methodologies for temperature profiling. 18 pages. Released May 2001.