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>IPC Standards>Assembly support>IPC-9707 - Amendment 1
 Current revisionReleased: 01.05.2018
IPC-9707 - Amendment 1

IPC-9707 - Amendment 1

Spherical Bend Test Method for Characterization of Board Level Interconnects

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Standard Number:IPC-9707 - Amendment 1
DOD Adopted:No
ANSI Approved:No
Released:01.05.2018
ISBN (English):978-1-61193-376-5
Pages (English):7
DESCRIPTION

Base standard to this Amendment is available here

IPC/JEDEC-9707-AM1 is an amendment which clarifies that the standard is only applicable to transient bending during short-term test operations. The standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly, manufacturing, and test operations.