IPC-9707 - Standard Only
Spherical Bend Test Method for Characterization of Board Level Interconnects
| Standard Number: | IPC-9707 - Standard Only |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Released: | 13.09.2011 |
| ISBN (English): | 978-1-61193-002-3 |
| Pages (English): | 15 |
Amendment 1 to IPC-JEDEC-9707 is available here
This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies.This document was developed cooperatively with JEDEC. 15 pages. Released 2011.
Included in the C-103 and C-1000 Collections.