PRICES include / exclude VAT
Current revisionReleased: 01.01.1987
IPC-HM-860 - Standard Only
Specification for Multilayer Hybrid Circuits
Format
Availability
Price and currency
English Secure PDF
Immediate download
Non-printable
168.30 EUR
English Hardcopy
10-14 days
252.45 EUR
View table of Contents
| Standard Number: | IPC-HM-860 - Standard Only |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Released: | 01.01.1987 |
| Pages (English): | 75 |
DESCRIPTION
Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements. 75 pages. Released January 1987.