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Current revisionReleased: 01.07.1996
IPC-J-STD-013 - Standard Only
Implementation of Ball Grid Array & Other High Density Technology
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| Standard Number: | IPC-J-STD-013 - Standard Only |
| Released: | 01.07.1996 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Pages (English): | 103 |
DESCRIPTION
This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96 Pages. Released July 1996.
Equivalent to IEC Publicly Available Standard (PAS) 62085