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Current revisionReleased: 01.01.2006
IPC-TR-001 - Standard Only
An Introduction to Tape Automated Bonding Fine Pitch Technology
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English Secure PDF
Immediate download
Non-printable
136.85 EUR
English Hardcopy
10-14 days
205.28 EUR
| Standard Number: | IPC-TR-001 - Standard Only |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Released: | 01.01.2006 |
| Pages (English): | 68 |
DESCRIPTION
This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 68 pages. Released by the Surface Mount Council January 1989.