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Current revisionReleased: 01.07.2001
IPC-TR-486 - Standard Only
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
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131.75 EUR
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197.63 EUR
| Standard Number: | IPC-TR-486 - Standard Only |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Released: | 01.07.2001 |
| Pages (English): | 56 |
DESCRIPTION
This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 56 pages. Released July 2001.