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IPC-6013 - Revision C
Qualification and Performance Specification for Flexible Printed Boards
Qualification and Performance Specification for Flexible Printed Boards
Released: 18.12.2013
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168.30 EUR
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252.45 EUR
IPC-6013 - Revision D
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Released: 01.09.2017
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168.30 EUR
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10-14 days
252.45 EUR
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168.30 EUR
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10-14 days
252.45 EUR
Polish Secure PDF
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238.85 EUR
Polish Hardcopy
10-14 days
358.28 EUR
IPC-6013 - Revision E - Medical Addendum
Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Released: 01.03.2022
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50.15 EUR
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10-14 days
75.23 EUR
IPC-6015 - Standard Only
Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures
Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures
Released: 01.02.1998
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94.35 EUR
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141.53 EUR
IPC-6017 - Revision A
Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry
Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry
Released: 01.08.2021
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94.35 EUR
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141.53 EUR
IPC-6018 - Revision D
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Released: 01.02.2022
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168.30 EUR
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252.45 EUR
IPC-7091 - Revision A
Design and Assembly Process Implementation of 3D Components
Design and Assembly Process Implementation of 3D Components
Released: 01.01.2023
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168.30 EUR
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IPC-7092 - Revision A
Design and Assembly Process Implementation for Embedded Circuitry
Design and Assembly Process Implementation for Embedded Circuitry
Released: 01.10.2022
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168.30 EUR
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252.45 EUR
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235.45 EUR
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10-14 days
353.18 EUR
IPC-7095 - Revision E
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
Released: 12.09.2024
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168.30 EUR
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252.45 EUR
IPC-7526 - Revision A
Stencil and Misprinted Board Cleaning Handbook
Stencil and Misprinted Board Cleaning Handbook
Released: 01.03.2022
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158.10 EUR
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237.15 EUR
IPC-7530 - Standard Only
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
Released: 01.05.2001
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168.30 EUR
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252.45 EUR
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168.30 EUR
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10-14 days
252.45 EUR
Hungarian Secure PDF
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131.75 EUR
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197.63 EUR
IPC-7530 - Revision B
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
Released: 31.01.2025
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168.30 EUR
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252.45 EUR
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235.45 EUR
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10-14 days
353.18 EUR