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IEC 60749-22:2002/COR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Released: 2003-08-13
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IEC 60749-8:2002/COR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Released: 2003-04-23
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IEC 61580:1995/COR1:2006
Corrigendum 1 - Measurement of return loss on waveguide and waveguide assemblies
Corrigendum 1 - Measurement of return loss on waveguide and waveguide assemblies
Released: 2006-07-24
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IEC 61603-1:1997/COR1:1997
Corrigendum 1 - Transmission of audio and/or video and related signals using infra-red radiation - Part 1: General
Corrigendum 1 - Transmission of audio and/or video and related signals using infra-red radiation - Part 1: General
Released: 1997-05-09
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IEC 61869-4:2013/COR1:2014
Corrigendum 1 - Instrument transformers - Part 4: Additional requirements for combined transformers
Corrigendum 1 - Instrument transformers - Part 4: Additional requirements for combined transformers
Released: 2014-08-27
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IEC 62047-10:2011/COR1:2012
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Released: 2012-02-28
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IEC 62319-1:2005/COR1:2009
Corrigendum 1 - Polymeric thermistors - Directly heated positive step function temperature coefficient - Part 1: Generic specification
Corrigendum 1 - Polymeric thermistors - Directly heated positive step function temperature coefficient - Part 1: Generic specification
Released: 2009-03-24
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