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IPC-6012 - Revision D - Automotive Addendum
Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards
Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards
Released: 01.04.2016
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205.28 EUR
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94.35 EUR
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141.53 EUR
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IPC-6012 - Revision E
Qualification and Performance Specification for Rigid Printed Boards
Qualification and Performance Specification for Rigid Printed Boards
Released: 01.02.2020
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390.15 EUR
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IPC-6012 - Revision E - Medical Addendum
Medical Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
Medical Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
Released: 01.08.2020
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IPC-7094 - Revision A
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
Released: 01.01.2018
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IPC-7095 - Revision C
Design and Assembly Process Implementation for BGAs
Design and Assembly Process Implementation for BGAs
Released: 28.01.2013
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IPC-7351 - Revision B
Generic Requirements for Surface Mount Design and Land Pattern Standard
Generic Requirements for Surface Mount Design and Land Pattern Standard
Released: 30.06.2010
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IPC-7525 - Revision B
Stencil Design Guidelines
Stencil Design Guidelines
Released: 24.10.2011
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IPC-7525 - Revision C
Stencil Design Guidelines
Stencil Design Guidelines
Released: 30.11.2021
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IPC-7621 - Standard Only
Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
Released: 01.01.2018
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IPC-7711-21 - Revision B
Rework, Modification and Repair of Electronic Assemblies
Rework, Modification and Repair of Electronic Assemblies
Released: 30.11.2007
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