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IEC TS 62098:2000
Evaluation methods for microprocessor- based instruments
Evaluation methods for microprocessor- based instruments
Released: 2000-11-22
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IEC TR 62251:2003
Multimedia systems and equipment - Quality assessment - Audio-video communication systems
Multimedia systems and equipment - Quality assessment - Audio-video communication systems
Released: 2003-05-16
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226.80 EUR
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IEC 61603-7:2003
Transmission systems of audio and/or video and related signals using infra-red radiation - Part 7: Digital audio signals for conference and similar applications
Transmission systems of audio and/or video and related signals using infra-red radiation - Part 7: Digital audio signals for conference and similar applications
Released: 2003-05-22
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226.80 EUR
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IEC 60749-2:2002
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
Released: 2002-04-12
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IEC 60749-11:2002
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
Released: 2002-04-12
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IEC 60747-16-3:2002
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
Released: 2002-05-07
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IEC 60050-482:2004
International Electrotechnical Vocabulary (IEV) - Part 482: Primary and secondary cells and batteries
International Electrotechnical Vocabulary (IEV) - Part 482: Primary and secondary cells and batteries
Released: 2004-04-07
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IEC 60404-1-1:2004
Magnetic materials - Part 1-1: Classification - Surface insulations of electrical steel sheet, strip and laminations
Magnetic materials - Part 1-1: Classification - Surface insulations of electrical steel sheet, strip and laminations
Released: 2004-04-20
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IEC 60512-12-7:2001
Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method
Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method
Released: 2001-01-24
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IEC 61518:2001
Mating dimensions between differential pressure (type) measuring instruments and flanged-on shut-off devices up to 413 BAR (41,3 MPa)
Mating dimensions between differential pressure (type) measuring instruments and flanged-on shut-off devices up to 413 BAR (41,3 MPa)
Released: 2001-01-24
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