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>UNE standards>UNE EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (Endorsed by AENOR in July of 2012.)
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in stockReleased: 2012-07-01
UNE EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (Endorsed by AENOR in July of 2012.)

UNE EN 60749-20:2009

Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (Endorsed by AENOR in July of 2012.)

Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 20: Resistencia de los dispositivos de montaje superficial (SMD) encapsulados en plástico al efecto combinado de humedad y de calor de soldadura. (Ratificada por AENOR en julio de 2012.)

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77 EUR
Standard number:UNE EN 60749-20:2009
Pages:31
Released:2012-07-01
DESCRIPTION

This standard UNE EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (Endorsed by AENOR in July of 2012.) is classified in these ICS categories:

  • 31.080.01
Categories:
UNE standards
31.080.01 Semiconductor devices in general
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